Ball grid array, or BGA, is a packaging system that is used to attach microchips to printed circuit boards. In this system, balls of solder are used to permanently attach the chips to the board. Many companies use BGA sockets and adapters because they provide increased levels of electrical performance. In addition, these products are known to withstand heat better than pins and adapters.

One of the best uses for locking sockets is adaptability. If you're working on a new chip design, or a new computer system, you can exchange the surface mount without having to solder the device every time. If you're in the market for BGA products it's important to know the specifications for your products. In most cases BGA products are organized according to size, pin count or ball count, and grid organization.

The Evolution of BGA

Many different industries rely on integrated circuits for transmitting electronic signals. Integrated circuits are often used in computers, communications, manufacturing and transportation systems just to name a few applications. The chips used in IC systems transmit millions of tiny pieces of information to a printed circuit board.

Integrated circuits rely on a number of different surface mount technologies. Over the years the number of transmitters used in IC systems has increased tremendously. The first systems, called SSI used transistors numbering in the tens. The next system called MSI, or medium scale integration used hundreds of transistors. Over the years the number of transistors increased to millions of transistors per chip. As the number of transistors increased so did the need for reliable packaging and interconnectivity systems such as ball grid array and surface mount components.