Dip Sockets

Written by Rylee Newton
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Dual in-line package or DIP, is a through-hole mounting package that is arranged in a series of two connecting pins. These pins are spaced evenly along the two longer sides of a rectangular housing package, and mounted to the printed circuit board. These devices are used in integrated circuits to provide space on the circuit board for additional components and memory elements.

The Joint Electron Device Engineering Council has set the standards for spacing of the lead pins at 0.1. JEDEC also determines the correct spacing in between rows. The standard spacing for rows is three inches for smaller devices, and six inches for larger devices. Larger devices typically contain 24 or more pins. In order to meet industry wide standards, manufactures must provide information on their grid structure to potential customers.

Uses for DIP Sockets and Switches

Dual in-line packages are typically made of either plastic or ceramic. They are used in upgrading microprocessors and are also used in toggles or switches to add versatility. Broadcast equipment often contains dual in-line packages. For example, broadcast patching systems often contain dual in-line switches that make grounding quick and easy.

When applying dual in-line packages to your systems you can either solder them to the circuit board or you can invest in DIP sockets. Many manufacturers prefer sockets because they eliminate the need for soldering materials in hard to reach places, and they also reduce the number of blind spots on the PCB. While the soldering process has become more uniform and reliable thanks to advances in manufacturing, there is still a degree of error in the process that isn't present when using prefabricated sockets.

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