Fine Pitch Bga Sockets

Written by Jarret Ewanek
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Before you invest in integrated circuits and BGA packages, it's important to understand some of the basic terms used in this field. For one thing, BGA stands for ball grid array. This is a leading package that consists of tiny balls of solder that are used to mount a microprocessing chip to a circuit board. The use of this technology frees up space on the circuit board for new additional memory and other items.

When engineers and technicians use the term "pitch" they are referring to the amount of space between leads on a given grid. Fine pitch BGA refers to any leading package where the distance between balls is less then 1.0 millimeters. In recent times engineers have introduced packages called fxBGA where the circuit density is greater and the electrical performance is even better.

What to Look for in Fine Pitch BGA

The Joint Electron Device Engineering Council describes fine pitch BGA as a "near chip package type." This makes it an ideal packaging system for low input output devices with I/O rates ranging from 24 to 208. In addition, medium I/O devices with counts ranging up to 400 can utilize this format. It's a good idea to check with the manufacturer of your BGA sockets and components to make sure you meet industry wide standards.

When shopping for a reliable fine pitch BGA package, it's a good idea to check test results for reliability. The last thing you want to do is invest in a packaging device that slows down production, or doesn't meet with the demands of your particular industry or application. In addition, you want to make sure to ask the manufacturer or retailer about rework options. Most packing devices can be reworked at least once in their lifetimes.

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