Land Gird Array, or LGA, is just one of the many surface mount packaging systems on the market today. By definition, LGA is a package that does not contain any terminations on the bottom of the package. The exposed package must be mounted onto a printed circuit board, and proper connections must be made in order for the device to function correctly.

In order for the pads on the bottom of the LGA to make contact with the printed circuit board you need to use either wires or pins to create tension on the package. Many manufacturers use LGA sockets to connect the package to the printed circuit board. In addition, you need to provide some sort of device for holding the package in place, and maintaining the contact points.

Advantages of LGA Packaging

One of the main reasons for using land grid array packages and other surface mount connectors is to increase the number of pins that fit on a printed circuit board. When you have more pins in a small amount of space you can increase the overall output of your system. In addition, engineers prefer LGA because it provides for a shorter distance from the pin to the connection point. This helps to ensure the clarity and quality of the signal.

Land grid array is also known for producing low inductance rates. This is due to the fact that the distance from the bottom of the package to the printed circuit board is very short. These sockets are also ideal for upgrading your system. They are easy to remove, which helps to prevent any damage, and makes the entire manufacturing process easier than ever. Unfortunately, LGA sockets are more difficult to install than some other surface mount devices. In most cases it's a good idea to hire a skilled, and highly trained technician to install these sockets in your computers and other electronic devices.