Micro Bga

Written by Jarret Ewanek
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If you've ever wondered how small electronic devices can do so many different things, and contain so much information, you have micro BGA technology to thank for it. BGA, or ball grid array, is a term used to describe the way the memory chip is attached to the printed circuit board. Rather than connecting to the board with pins or leads, BGA packages are connected using tiny balls of solder. Micro BGA packages are often used to increase the memory capacity and functionality of small electronic devices such as cell phones, PDAs, hand-held games, and GPS navigation systems.

If you want to add these packages to handheld devices it's important to find ones that don't interfere with the functionality of the devices. Many of the BGA packages on the market today have been designed to fit easily onto consumer electronic devices without disturbing the integrity of current operating systems. You can find several packages that don't require any restructuring of the printed circuit board whatsoever.

Increase Memory with Micro BGA

If you're thinking about upgrading your products with additional memory you can do so with a small initial capital investment. Depending on your manufacturing capabilities you can even install these devices yourself in no time at all. Installing additional memory increases the speed of your systems, which leads to greater customer satisfaction.

Once you find a manufacturer that meets your specifications, it's a good idea to review their testing practices. You want to make sure to invest in memory packages that have undergone extensive testing for reliability and life cycle. The last thing you want to do is promise your customers larger memory devices if you can't deliver on your promise. Manufacturers of ball grid array packages of all sizes must meet federal guidelines and specifications.


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