Pin Grid Array Packages

Written by Rylee Newton
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Pin grid array packages usually have 370 pins that are arranged in a grid on the bottom of the microprocessor. Pin counts help to determine how much additional function the connector provides to the overall system. In recent times engineers have focused on finding ways to increase pin counts in a limited amount of space. This technology is often used in small electronic devices and other consumer electronics.

PGA chip packages are typically housed in sockets that make them easy to insert and remove from the motherboard. These sockets allow you to increase memory and speed without taking up precious space on the printed circuit board. There are a number of different pin grid array packages that serve different computers and other electronic devices. It's important to consult with a technician to find the specifications that meet your needs.

Flip Chip PGA Packages

One of the most popular of the pin grid array packages is the FC-PGA or flip chip pin grid array. FC-PGA is known for providing greater resistance to thermal conditions than some of the other connector options on the market today. FC-PGA packages are designed so that the hottest part of the chip is located on the side of the connector that is farthest away from the motherboard. This helps to ensure the components aren't damaged when exposed to heat.

The core of information found in the processor is placed on the "flip side" of the chip, protecting the microprocessor's engine from damage. When using FC-PGA packages you need to attach a thermal heatsink to the back of the processor to aid in heat dissipation. Before installing any PGA packages it's important to make sure that your motherboard supports the product, and adheres to strict industry-wide standards.


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