If you're experiencing difficulties in your surface mount technology package, you can solve the problem with SMT rework. SMT rework is a process where the package is heated, and often removed for replacement or repair. Heated air is often used to loosen the connections and contact points. You can find a wide range of products to help you rework packages in a number of different shapes and sizes.

Some of the main problems faced by SMT packages include: solder bridge malfunctions, excess solder, insufficient soldering paste, flipped or missing components, voiding and separations, and malfunctions with the solder balls or the contact pads. All of these problems can be addressed by professional rework specialists. Depending on the nature of the problem, many companies opt to perform their own rework projects to save time and money.

Common SMT Malfunctions

One of the most common problems is excess solder. When too much solder is used to mount the package to the printed circuit board, the joint of the connector becomes too rigid. Over time this condition can lead to cracking and other system failures. Many times excess solder is a result of poor initial footprint design and failures at the development stage. You can address problems with excess solder by heating up the package, and removing the solder with a de-soldering braid.

If there is not enough paste on the pads during the application process, your system may also face failures. This is a common problem in small outline packages, where chips are located very close to one another on the board. In addition, the lack of solder can be due to clogging of stencils or other application tools. You can address this problem by removing the components with a soldering iron, and properly cleaning the application tools.